The Ultra Fine Polishing Powder comes in three different variants - Silicon Carbide, Aluminum Oxide, and Cerium Oxide. These variants are produced using advanced grading technology, which ensures that they have high purity, excellent crystal shape, and uniform particle size distribution. These features make them ideal for use in various industries such as optics, communications, display, semiconductor, data storage, and more.
The Silicon Carbide variant of the Ultra Fine polishing powder is known for its excellent hardness and wear resistance. It is commonly used for polishing hard materials such as ceramics, glass, and metals. Additionally, it is also used for lapping and grinding applications.
The Aluminum Oxide variant of the Ultra Fine polishing powder is known for its high purity and excellent polishing performance. It is commonly used for polishing soft materials such as plastics, rubber, and wood. Additionally, it is also used for surface finishing applications.
The Cerium Oxide variant of the Ultra Fine Polishing powder  is known for its high polishing efficiency and excellent surface quality. It is commonly used for polishing glass, optics, and semiconductors. Additionally, it is also used for precision polishing applications.
Overall, the Ultra Fine polishing powder is a versatile and reliable product that can be used in various industries for different applications. Its advanced grading technology ensures that it has consistent quality and performance, making it a preferred choice for many professionals.
Features
1. Fine particle size and adjustable polishing effectiveness can meet various polishing requirements;
2. Centralized particle size distribution and good crystal shape can achieve precision polishing result in short time;
3. High purity can meet the request from magnetic record materials like hard disk, and semiconductor materials like silicon and other high-tech fields.
Applications: 1. Semiconductor  2. Optical glass & crystal 3. Hard disk 4. LCD panel
5. Optical communication