The Polycrystalline Diamond Slurry is a specialized chemical formula that mixes polycrystalline diamond powder and dispersion after classification. It is a highly effective solution for polishing a wide range of materials, including sapphire substrates, tantalum carbide substrates, ceramic substrates, compound crystals, precision optics, liquid crystal panels, gemstones, and metal workpieces.
This slurry is made using state-of-the-art technology that ensures the highest quality and consistency in every batch. It is designed to provide exceptional performance, delivering a superior finish that is free from scratches, cracks, or other imperfections.
One of the key advantages of the Polycrystalline diamond Slurry is its versatility. It can be used for a wide range of applications, making it an ideal choice for businesses that require a single solution for multiple polishing needs. It is also highly efficient, reducing the time and effort required for polishing, which can lead to significant cost savings.
In addition to its exceptional performance and versatility, the Polycrystalline diamond Slurry is also highly durable. It is designed to withstand the rigors of industrial use, ensuring that it can provide reliable performance over an extended period of time.
Overall, the Polycrystalline diamond Slurry is an outstanding solution for businesses that require a high-quality, versatile, and durable polishing solution. With its exceptional performance and efficiency, it can help businesses improve their productivity and profitability, while also delivering a superior finish that meets the most demanding standards.
Features:

1. High-Quality Polycrystalline Diamond:

   • Composed of multiple microcrystalline structures that provide numerous cutting edges.

   • Offers greater efficiency in material removal compared to monocrystalline diamonds.

2. Excellent Particle Dispersion:

   • Uniformly distributed diamond particles prevent clumping and ensure consistent performance.

   • Provides reliable and repeatable results across different applications.

3. High Removal Rate:

   • Rapid material removal enhances productivity and reduces processing times.

   • Suitable for applications requiring quick and precise lapping and polishing.

4. Superior Surface Finish:

   • Achieves exceptionally smooth and defect-free surfaces.

   • Ideal for applications demanding high clarity and minimal surface defects.

5. Eco-Friendly and Easy to Clean:

   • Water-based formula is environmentally safe and easy to clean.

   • Leaves no residue, simplifying post-polishing maintenance.

Applications:

• Optical Lens Polishing:

  • Produces high-clarity finishes essential for precision optics and photonics.

  • Ensures superior optical performance and minimal distortion.

• Semiconductor Wafer Polishing:

  • Provides smooth, defect-free surfaces for semiconductor wafers.

  • Critical for manufacturing high-performance electronic components.

• Ceramic and Metal Surface Finishing:

  • Effective for polishing advanced ceramics and metals.

  • Enhances component durability and functional performance.

• Gemstone and Jewelry Polishing:

  • Delivers brilliant, high-quality finishes on gemstones and fine jewelry.

  • Ensures aesthetic appeal and maximizes value.

Instructions for Use:

1. Preparation:

   • Clean the workpiece thoroughly to remove any contaminants.

   • Shake the bottle well to ensure even distribution of diamond particles before use.

2. Application:

   • Apply the slurry directly onto the lapping or polishing surface.

   • Use with an appropriate polishing pad or plate, such as a polyurethane (PU) polishing pad, for optimal results.

3. Polishing Process:

   • Apply consistent pressure and motion to achieve an even surface finish.

   • Monitor the process closely to ensure optimal material removal and surface quality.

4. Post-Polishing:

   • Clean the workpiece to remove any residual slurry.

   • Inspect the surface for the desired finish and repeat the process if necessary.

Customization:

We offer various customization options to meet specific application needs, including:

• Particle Size: Customizable to achieve specific surface finishes and removal rates.

• Concentration: Adjustable to suit different lapping and polishing requirements.

• Packaging: Available in different sizes to accommodate varying usage volumes.